12

Laser bending of brittle materials

Year:
2010
Language:
english
File:
PDF, 500 KB
english, 2010
21

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Year:
2010
Language:
english
File:
PDF, 863 KB
english, 2010
32

Anisotropic Damage Mechanism during Grinding of CdZnTe Wafers

Year:
2010
Language:
english
File:
PDF, 1.89 MB
english, 2010
39

Effect of Mechanical Anisotropy on Grinding of CdZnTe Wafers

Year:
2010
Language:
english
File:
PDF, 1.49 MB
english, 2010